Advanced packaging and the new capacity bottleneck
Constraint has moved downstream. Foundry capacity is no longer the binding limit — substrate and packaging throughput now set the pace for advanced node delivery through 2027.
- Three suppliers control an estimated 71% of advanced substrate output.
- Announced 2027 capacity covers roughly half of projected demand.
- Pricing power has shifted toward packaging, away from wafer fabrication.
Exposure sits with the packagers, not the fabs. Position accordingly before capacity announcements land.
